About this event
Chip and package designers explore the engineering of chiplet-based systems through keynotes, technical sessions, panels and an exhibition. The series covers advanced packaging, die-to-die interfaces, design methods and AI acceleration. Its 2026 programme examined automated multi-die design, system-level connectivity, 3D IC implementation and the UCIe open chiplet ecosystem.
When
30 March - 1 April 2027
3 days
Price
See website