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VERSION:2.0
PRODID:-//Zevente//Tech events//EN
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BEGIN:VEVENT
UID:otjvtl@zevente.com
DTSTAMP:20261002T000425Z
LAST-MODIFIED:20261002T000425Z
DTSTART;VALUE=DATE:20270330
DTEND;VALUE=DATE:20270402
SUMMARY:Chiplet Summit 2027
DESCRIPTION:Chiplet architecture\, advanced packaging and die-to-die interf
 aces for chip and system designers.\n\nChip and package designers explore 
 the engineering of chiplet-based systems through keynotes\, technical sess
 ions\, panels and an exhibition. The series covers advanced packaging\, di
 e-to-die interfaces\, design methods and AI acceleration. Its 2026 program
 me examined automated multi-die design\, system-level connectivity\, 3D IC
  implementation and the UCIe open chiplet ecosystem.\n\nDetails and offici
 al website: https://zevente.com/e/chiplet-summit-2027-otjvtl?utm_source=ca
 lendar
LOCATION:Santa Clara Convention Center\, Santa Clara\, United States
URL;VALUE=URI:https://zevente.com/e/chiplet-summit-2027-otjvtl?utm_source=c
 alendar
CATEGORIES:Hardware,AI/ML
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