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VERSION:2.0
PRODID:-//Zevente//Tech events//EN
CALSCALE:GREGORIAN
METHOD:PUBLISH
BEGIN:VEVENT
UID:uaigy4@zevente.com
DTSTAMP:20260922T183209Z
LAST-MODIFIED:20260922T183209Z
DTSTART;VALUE=DATE:20270202
DTEND;VALUE=DATE:20270205
SUMMARY:DesignCon 2027
DESCRIPTION:High-speed chip\, board and systems design conference and expo 
 for signal-integrity and electronics engineers.\n\nDesignCon 2027 runs 2
 –4 February 2027 at the Santa Clara Convention Center. Informa’s flags
 hip Silicon Valley conference and exposition for chip\, board and systems 
 design engineers covers signal and power integrity\, high-speed links and 
 electronics design education with an expo floor.\n\nDetails and official w
 ebsite: https://zevente.com/e/designcon-2027-uaigy4?utm_source=calendar
LOCATION:Santa Clara Convention Center\, Santa Clara\, United States
URL;VALUE=URI:https://zevente.com/e/designcon-2027-uaigy4?utm_source=calend
 ar
CATEGORIES:Hardware
END:VEVENT
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